Fabrication of indium bumps for hybrid FPA applications// Infrared Physics and Technology. 2004. <...> New Reflow Process for Indium Bump// Proc. of SPIE.1996. <...> The matrixes of microcontacts of height more than 10 microns with a step 28 microns of the 384Ч288 format are made. <...> The width of a flute dividing (sharing) indium microcontacts does not exceed 5 m. <...>